Oppo partners with MediaTek to use the new Dimensity 9500 chip in its Find X9 series, promising faster AI performance, better battery life, and 5G efficiency for 2025.

Oppo is making big waves in the smartphone world again this time by teaming up with MediaTek to launch the all-new Dimensity 9500 chipset in its upcoming Find X9 series. This move signals Oppo’s shift toward more powerful, energy-efficient, and AI-driven devices that can compete head-to-head with Qualcomm’s Snapdragon lineup.

A Strategic Partnership for Smarter Performance

MediaTek’s Dimensity 9500 is built on TSMC’s 3nm process, delivering faster speeds and better thermal control. Oppo plans to use this chipset in the Find X9 Pro and X9 models, aiming to enhance multitasking, gaming, and camera performance all while keeping power consumption low.

AI at the Core

The Dimensity 9500 integrates MediaTek’s APU 790 AI engine, designed to boost image processing, voice recognition, and real-time translation features. Oppo’s collaboration ensures these AI features are deeply embedded into ColorOS for a smoother user experience.

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Better Connectivity and Battery Life

The new chipset supports 5G UltraSave 3.0, Wi-Fi 7, and dual SIM 5G standby ideal for users who demand speed without sacrificing battery life. Oppo’s optimization layer promises up to 20% better efficiency during gaming and media streaming.

A Challenge to Snapdragon’s Dominance

With this move, Oppo and MediaTek are directly challenging Qualcomm’s dominance in the flagship segment. If early benchmarks are accurate, the Dimensity 9500 could outperform the Snapdragon 8 Gen 4 in several real-world tests especially in sustained performance and heat management.

In Conclusion, Oppo’s partnership with MediaTek could redefine what Android flagships offer in 2025. With AI-enhanced capabilities, improved efficiency, and impressive connectivity, the upcoming Find X9 series is shaping up to be one of the most powerful smartphone releases of the year.